| Product Features |
| shielding ED copper foil |
| thickness 0.009--3mm, width 10-1380mm |
| easier to make a faraday cage, EMI room |
| generally 400-500kg/roll |
| Physical Properties |
| Density:8.9g/cm³ |
| Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min |
| Thermal conductivity(20°C):390W/(m°C) |
| Elastic modulus:118000N/m |
| Softening temperature:≥380°C |
| Certification |
| meet the technical conditions GB/T 5187-2008 standards. |
| in accordance with ISO9001-2000 Quality system requirements |
Product Advantages
Design and Structural Integrity for EMI Filter Manufacturing
The copper foil’s laminated structure incorporates a conductive acrylic adhesive optimized for easy die-cutting and lamination without compromising electromagnetic shielding effectiveness. Its standard 1320 mm width accommodates large-scale shielding panels, reducing joint seams and potential EMI leakage points. This modular design approach harmonizes with various EMI filter circuit architectures, supporting customization by single phase EMI filter manufacturers. The design ensures dimensional stability and uniform conductivity, essential for high-reliability EMI filter integration in medical and industrial environments.
Enhanced Performance and User-Centric Functionality
Beyond structural benefits, the 4oz copper foil delivers exceptional electrical and thermal conductivity, critical for maintaining consistent EMI suppression performance. User-friendly features including adhesive release paper simplify handling and application, facilitating efficient assembly in EMI filters and shielding enclosures. These factors contribute to reduced installation time and higher yield rates within production cycles, delivering cost efficiency alongside high-performance electromagnetic interference mitigation. The foil’s compliance with stringent standards assures users of quality and durability throughout operational lifespans.
EMI RFI shielding copper tape strip, lightning copper tape
Product description:
1.The product structure is based on copper foil as the substrate, conductive acrylic adhesive as the adhesive, plus release paper.
2.Three-tier architecture is very suitable for cutter mold or the metal mold die-cutting, Can be flat cutter or round cutter to die-cutting.
3.The width of the product available from 3mm ~ 380mm. Standard length is 50m., also do 100m, 150m or longer, save customers the trouble of frequently reloading.
Product Properties:
| Part Number | Backing Material | Thickness of Backing (mm) | Total Thickness (mm) | Holding Power Min/inch | Adhesion Strength kg/25mm | Adhesive Component | Shield Efficacy 10MHz~ 1GHz (dB) | Conductivity z-ohms | Integrated thermal conductivity (W/mK) |
| XPH0M123 | Copper Foil | 0.012 | 0.030±0.01 | ≥1440 | >0.8 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M183 | Copper Foil | 0.018 | 0.050±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M253 | Copper Foil | 0.025 | 0.06±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 80 |
| XPH0M353 | Copper Foil | 0.035 | 0.070±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 90 |
| XPH0M503 | Copper Foil | 0.050 | 0.085±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 110 |
| XPH0M753 | Copper Foil | 0.075 | 0.11±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 130 |
| XPH0MA03 | Copper Foil | 0.100 | 0.135±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 160 |
| XPH0MA23 | Copper Foil | 0.125 | 0.15±0.015 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 170 |
| XPH0MA53 | Copper Foil | 0.150 | 0.20±0.02 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 |
190
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Use Scenarios
Precision Shielding in MRI Room Construction
In the medical imaging sector, this copper foil is instrumental for MRI facilities requiring robust EMI filter circuits to ensure precise magnetic resonance imaging without distortion. Serving as the primary conductive layer in MRI Faraday cages, it offers high-purity conductivity and thermal management crucial for stable shielding environments. Its adhesive-backed design supports seamless integration into shielding panels and doors, enabling facility engineers to maintain compliance with electromagnetic compatibility standards and safeguard sensitive diagnostic equipment from external interference.
Fabrication of Shielded Enclosures for EMI/RFI Protection
The copper foil is extensively applied in manufacturing EMI filters and shielding enclosures for electronics testing labs and industrial automation systems. As a critical component within EMI filter circuits, it reduces conduction and radiation of interference across power and signal lines. The foil’s availability in diverse widths and lengths facilitates tailored solutions for various enclosure geometries, enabling single phase EMI filter manufacturers and system integrators to enhance compatibility and optimize electromagnetic containment within complex industrial workflows.
