EMI Shielding Copper Wool 99.9% Copper For EMC Chamber
Functional Positioning for Electromagnetic Compatibility Engineering
EMI Shielding Wire Mesh Copper Wool 99.9% is designed specifically to enhance electromagnetic compatibility in EMC testing chambers and shielded enclosures. Targeted at engineers, system integrators, and procurement managers in the emi filter industry, this product offers a flexible shielding solution ideal for safeguarding sensitive electronics. Its composition enables efficient filling of gaps, seams, and complex geometries where traditional solid shielding sheets prove impractical. This wire mesh empowers professionals requiring high-precision containment of electromagnetic interference while maintaining system reliability and compliance in demanding environments.
Technical Specifications Underpinning Superior EMI Shielding Performance
Constructed from copper wool with a purity of 99.9%, this emi filter component exhibits exceptional electrical conductivity and corrosion resistance. Its physical form as a flexible wire mesh facilitates rapid and adaptable installation in EMC chambers. The product conforms to CE and RoHS certifications, affirming its quality and environmental compliance. With a minimum order quantity of approximately 2.5 kg and a standard lead time of 7 to 10 workdays, this product is optimized for streamlined supply chain management. These measurable specifications make it a dependable element in effective emi filter circuit design and deployment.
Industry Applications Delivering Reliable EMI Containment Solutions
This EMI Shielding Wire Mesh supports multiple applications across sectors requiring stringent electromagnetic interference control, such as medical imaging rooms and industrial test facilities. It serves as a key component in constructing Faraday cages and refurbishing RF shielded rooms, ensuring minimal interference leakage. By integrating with existing emi filters and shielding solutions, it enhances the continuity and robustness of electromagnetic protection systems. Its facilities-compatible design maximizes operational integrity in sensitive measurement, testing, and frequency inverter environments, providing practical benefits for advanced EMI control strategies.
Product Advantages
Structural and Design Advantages in EMI Shielding Integration
The copper wool mesh’s flexible and adaptive architecture ensures seamless integration within complex shielded enclosures, overcoming spatial and geometric constraints common in EMI containment systems. This design enables continuous shielding coverage, critical for the operational efficacy of emi filters and related systems. The 99.9% copper purity enhances conductivity, reducing signal attenuation and supporting consistent EMI filter circuit performance. Modular and scalable, the product accommodates various configurations, simplifying system-wide EMI management in technical applications where precision and scalability are paramount.
Performance Enhancements and Practical User Benefits
High electrical conductivity combined with corrosion-resistant copper material guarantees long-term durability and stable performance under diverse environmental conditions. The wire mesh’s pliability expedites installation processes, lowering labor costs and minimizing setup time for engineers managing complex shielding projects. This efficiency directly supports faster deployment cycles without compromising quality or EMI filtering integrity. By enhancing connection continuity within electromagnetic containment frameworks, the mesh contributes measurable improvements in system reliability and compliance with industry standards related to electromagnetic interference mitigation.
What are the types of shielding for EMI/RF?
The primary types of EMI shielding are shielding directly on a printed circuit board, or around the seams of an enclosure. Depending on the application, a board level shield, finger stock gasket or fabric over foam gasket would be preferable.
What are common applications of the different shielding types? Which shielding types are preferred for different applications?
Selecting the right type of EMI shielding solution begins with analyzing many factors such as the environment, RF frequencies of concern to the project and mechanical requirements.
When picking a board level shield, what are the benefits of Nickel Silver versus Tin-Plated Steel?
Tin-plated steel and nickel silver perform at a relatively similar rate, however the difference between the two is the frequency ranges that each performs better at. Tin plated steel is preferable if trying to block low frequency waves from creating interference, while nickel silver blocks mid to high frequency waves more effectively. Each will block EMI/RF across different ranges but specialize within their specific ranges.
| Product description | |
| Name | copper foil |
| Material | 99.8% copper |
| Width | standard 1350mm |
| Thickness | standard 0.105mm(3oz),0.14mm(4oz) |
| Feature | EMI shielding |
| Application | faraday cage,MRI room |
Product description:
1. The product structure is based on copper foil as the substrate, conductive acrylic adhesive as the adhesive, plus release paper.
2. Three-tier architecture is very suitable for cutter mold or the metal mold die-cutting, Can be flat cutter or round cutter to die-cutting.
3. The width of the product available from 3mm ~ 380mm. Standard length is 50m., also do 100m, 150m or longer, save customers the trouble of frequently reloading.
| Part Number | Backing Material | Thickness of Backing (mm) | Total Thickness (mm) | Holding Power Min/inch | Adhesion Strength kg/25mm | Adhesive Component | Shield Efficacy 10MHz~ 1GHz (dB) | Conductivity z-ohms | Integrated thermal conductivity (W/mK) |
| XPH0M123 | Copper Foil | 0.012 | 0.030±0.01 | ≥1440 | >0.8 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M183 | Copper Foil | 0.018 | 0.050±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M253 | Copper Foil | 0.025 | 0.06±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 80 |
| XPH0M353 | Copper Foil | 0.035 | 0.070±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 90 |
| XPH0M503 | Copper Foil | 0.050 | 0.085±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 110 |
| XPH0M753 | Copper Foil | 0.075 | 0.11±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 130 |
| XPH0MA03 | Copper Foil | 0.100 | 0.135±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 160 |
| XPH0MA23 | Copper Foil | 0.125 | 0.15±0.015 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 170 |
| XPH0MA53 | Copper Foil | 0.150 | 0.20±0.02 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 |
190
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| Product Features |
| shielding ED copper foil |
| thickness 0.009--3mm, width 10-1380mm |
| easier to make a faraday cage, EMI room |
| generally 400-500kg/roll |
| Physical Properties |
| Density:8.9g/cm³ |
| Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min |
| Thermal conductivity(20°C):390W/(m°C) |
| Elastic modulus:118000N/m |
| Softening temperature:≥380°C |
| Certification |
| meet the technical conditions GB/T 5187-2008 standards. |
|
in accordance with ISO9001-2000 Quality system requirements |
