Rf Shielding Copper Foil For MRI Chamber
| Product description | |
| Name | copper foil |
| Material | 99.8% copper |
| Width | standard 1350mm |
| Thickness | standard 0.105mm(3oz),0.14mm(4oz) |
| Feature | EMI shielding |
| Application | faraday cage,MRI room |
Product description:
1. The product structure is based on copper foil as the substrate, conductive acrylic adhesive as the adhesive, plus release paper.
2. Three-tier architecture is very suitable for cutter mold or the metal mold die-cutting, Can be flat cutter or round cutter to die-cutting.
3. The width of the product available from 3mm ~ 380mm. Standard length is 50m., also do 100m, 150m or longer, save customers the trouble of frequently reloading.
| Part Number | Backing Material | Thickness of Backing (mm) | Total Thickness (mm) | Holding Power Min/inch | Adhesion Strength kg/25mm | Adhesive Component | Shield Efficacy 10MHz~ 1GHz (dB) | Conductivity z-ohms | Integrated thermal conductivity (W/mK) |
| XPH0M123 | Copper Foil | 0.012 | 0.030±0.01 | ≥1440 | >0.8 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M183 | Copper Foil | 0.018 | 0.050±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M253 | Copper Foil | 0.025 | 0.06±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 80 |
| XPH0M353 | Copper Foil | 0.035 | 0.070±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 90 |
| XPH0M503 | Copper Foil | 0.050 | 0.085±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 110 |
| XPH0M753 | Copper Foil | 0.075 | 0.11±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 130 |
| XPH0MA03 | Copper Foil | 0.100 | 0.135±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 160 |
| XPH0MA23 | Copper Foil | 0.125 | 0.15±0.015 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 170 |
| XPH0MA53 | Copper Foil | 0.150 | 0.20±0.02 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 |
190
|
| Product Features |
| shielding ED copper foil |
| thickness 0.009--3mm, width 10-1380mm |
| easier to make a faraday cage, EMI room |
| generally 400-500kg/roll |
| Physical Properties |
| Density:8.9g/cm³ |
| Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min |
| Thermal conductivity(20°C):390W/(m°C) |
| Elastic modulus:118000N/m |
| Softening temperature:≥380°C |
| Certification |
| meet the technical conditions GB/T 5187-2008 standards. |
|
in accordance with ISO9001-2000 Quality system requirements |
