EMC shielding copper wool 0.07~0.08mm wire diameter for MRI room
What are the advantages of heat-treated beryllium copper finger stock?
Heat-treated beryllium copper finger stock has heightened spring properties while also being strengthened through the heat-treating process. This allows for the component to secure a seam of an enclosure from EMI/RF while also allowing for the enclosure to be opened and closed without risking damage to the shielding.
What are the benefits and risks of pursuing larger volume production runs?
As a new product is finalized and ramp-up milestones are reached, the process of manufacturing will pivot to focusing on higher quantity runs as the design and building processes are locked in. By gearing towards higher quantity runs, production quality can remain consistent as the quantities increase. Inputs by the customer to reach the higher quantity runs could be investments in custom tooling or progressive tools.
| Product description | |
| Name | copper foil |
| Material | 99.8% copper |
| Width | standard 1350mm |
| Thickness | standard 0.105mm(3oz),0.14mm(4oz) |
| Feature | EMI shielding |
| Application | faraday cage,MRI room |
Product description:
1. The product structure is based on copper foil as the substrate, conductive acrylic adhesive as the adhesive, plus release paper.
2. Three-tier architecture is very suitable for cutter mold or the metal mold die-cutting, Can be flat cutter or round cutter to die-cutting.
3. The width of the product available from 3mm ~ 380mm. Standard length is 50m., also do 100m, 150m or longer, save customers the trouble of frequently reloading.
| Part Number | Backing Material | Thickness of Backing (mm) | Total Thickness (mm) | Holding Power Min/inch | Adhesion Strength kg/25mm | Adhesive Component | Shield Efficacy 10MHz~ 1GHz (dB) | Conductivity z-ohms | Integrated thermal conductivity (W/mK) |
| XPH0M123 | Copper Foil | 0.012 | 0.030±0.01 | ≥1440 | >0.8 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M183 | Copper Foil | 0.018 | 0.050±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 60 |
| XPH0M253 | Copper Foil | 0.025 | 0.06±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 80 |
| XPH0M353 | Copper Foil | 0.035 | 0.070±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 90 |
| XPH0M503 | Copper Foil | 0.050 | 0.085±0.005 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 110 |
| XPH0M753 | Copper Foil | 0.075 | 0.11±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 130 |
| XPH0MA03 | Copper Foil | 0.100 | 0.135±0.01 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 160 |
| XPH0MA23 | Copper Foil | 0.125 | 0.15±0.015 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 | 170 |
| XPH0MA53 | Copper Foil | 0.150 | 0.20±0.02 | ≥1440 | >1.0 | Acrylic | ≥60 | <0.03 |
190
|
| Product Features |
| shielding ED copper foil |
| thickness 0.009--3mm, width 10-1380mm |
| easier to make a faraday cage, EMI room |
| generally 400-500kg/roll |
| Physical Properties |
| Density:8.9g/cm³ |
| Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min |
| Thermal conductivity(20°C):390W/(m°C) |
| Elastic modulus:118000N/m |
| Softening temperature:≥380°C |
| Certification |
| meet the technical conditions GB/T 5187-2008 standards. |
|
in accordance with ISO9001-2000 Quality system requirements |
